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The choice of the alloy depends primarily on the properties of the base metal and application. The selection of the solder alloy is also dependent on the method of application. Solder can be supplied as solid wire, flux cored wire and pastes. The pastes can be supplied in a tub or in some instances a syringe so that the process can be automated.

When selecting an alloy for soldering components factors such as melting point, plastic range, speed of wetting, ability to wet, flow and bond to different metals and also appearance after soldering must be taken into consideration.

Of all the many solders, tin-lead is regarded to be the largest single group of alloys used. When referring to tin/lead solders, the tin content is customarily given first. For example 40/60 refers to 40 percent tin and 60 percent lead by weight. Most metals can be joined with these alloys. In today's industry more and more companies are now looking at eradicating lead from the soldering operation due to its poisonous nature. There is now an extensive range of lead free alloys available to be used, which can replace lead bearing alloys.

Tin-lead solders are compatible with almost all base types of base-metal cleaners, fluxes, and heating methods. Increasing the tin content produces better wetting and flow characteristics. When less tin is used, greater care should be exercised in surface preparation of the metals to be joined as any contamination of the surface to be soldered may impede the flow of the solder. It is imperative that all surfaces to be soldered are thoroughly cleaned from all grease and oxides.

As soon as any heat is applied to the work piece a new oxide begins to form. This will prevent the chemical action of solder. Flux is designed to break this oxide down enabling soldering to be carried out successfully. In general use an acid–type flux for industrial applications is recommended and a rosin–type for electrical connections. Regardless of which flux is used soldering cannot be performed in the open air without the use of a suitable flux.

 

LEAD CONTAINING SOLDER ALLOYS

Product

PHYSICAL CHARACTERISTICS

 Composition %

 Melting Range ºC

 Corresponding Standard 

 

Sn (Tin)

Pb (Lead)

 

 DIN 1707

 (Old) BS 219

 BS EN 29453

 QQ-S-571E

SIL 63-37 63
Bal
183
Sn63Pb
A
S-Sn63Pb37Sb

Sn60

SIL 60-40

60

Bal

183 – 188

Sn60Pb

KP

S-Sn60Pb40Sb

Sn60

SIL 50-50

50

Bal

183 – 212

Sn50Pb

F

S-Pb500Sn50/Sb

Sn50

SIL 40-60

40

Bal

183 – 234

Pb60Sn

G

S-Pb60Sn40

Sn40

SIL 33-67

33

Bal

183 – 244

PbSn33

 

 

 

SIL 30-70

30

Bal

183 – 255

PbSn30

J

S-Pb70Sn30

Sn30

SIL 20-80

20

Bal

183 – 275

 

 

 

 

SIL 15-85

15

Bal

227 – 288

 

 

 

 

LEAD FREE SOLDER ALLOYS

Product

PHYSICAL CHARACTERISTICS

Composition %

Melting Range ºC 

Corresponding Standard

 

 Sn

 Cu

 Ag

 Sb

 

DIN 1707

(Old) BS 219

BS EN 29453

QQ-S-571E

SIL 98-2

Bal

 

2

 

221 - 225

 

 

 

 

SIL 97-3

Bal

 

3

 

221 - 230

 

97S

S-Sn96Ag3

 

SIL 96S

Bal

 

4

 

221

 

96S

S-Sn96Ag4

Sn96

SIL 95-5

Bal

 

5

 

221 - 235

SnAg5

 

 

Ag5.5

SIL 90-10

Bal

 

10

 

221 - 300

 

 

 

 

SIL 99-1 Cu

Bal

1

 

 

230 - 240

 

 

S-Sn99Cu1

 

SIL 97-3 Cu

Bal

3

 

 

230 - 250

SnCu3

 

S-Sn97Cu3

 

SIL 95-5 Sb

Bal

 

 

5

230 - 240

SnSb5

95A

 

Sb5

SIL 100

100

 

 

 

232

 

 

 

 


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